| Layers |
One to twenty layers |
| Max. panel size |
22" x 36" |
| Max. outer layer copper thickness |
6 oz. |
| Max. inner layer copper thickness |
3 oz. |
| Min. Line/Width Spacing |
3mil/3mil |
| Min. Finished Hole Size |
.008" (0.20mm) |
| Aspect ratio |
10:1 |
| SolderMask |
LPI and DryFilm |
| S/M Plug Hole |
0.028" (0.7 mm) |
| PTH tolerance |
+1mil/-2mil; +2mil/-1mil |
| NPTH tolerance |
+/- 1mil |
| Min. board thickness |
0.004" |
| Max. board thickness |
0.236" (6mm) |
| Blind and buried vias |
|
| Impedence control |
50,60,70 ohm+/- 10% |
| Laminate Tg |
Up to 200 degrees C |
| Finish |
HASL
Flash gold '(<3 microinches)'
Immersion gold (5-10 microinches)
40-50 microinches of soft gold
Thermonsonic gold bonding
Entek Cu (106)
Edge connector gold plating
Carbon printing/trimming
Silver cross over technology
|
| Type: |
Flexible |
Rigid-flex |
| Material: |
PI |
PET,PEN |
PI-FR4 |
| Layer: |
1-4 |
1-2 |
2-8 |
| Line-width/spacing |
0.75mm(3 mil) (single layer) |
| Line-width/spacing: |
.01mm (4 mil) (D/S, multilayer) |
| Min. finish hole size |
0.2mm |
| Surface finishing |
ENIG (maximum 0.075um) |
| Sn/Pb plating |
(2-20um) |
| HASL (rigid-flex only) |
|
(1-40um) |
